Molds and methods to control mold surface quality

ABSTRACT

A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (R a ) less than or equal to about 0.15 μm and a waviness height (W a ) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (R a ) less than or equal to about 0.15 μm and a waviness height (W a ) less than or equal to about 100 nm.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/234,114 filed on Aug. 11, 2016, which claims the benefit of priorityunder 35 U.S.C. § 119 of U.S. Provisional Application Ser. No.62/205,111 filed Aug. 14, 2015, the content of each are relied upon andincorporated herein by reference their entirety.

BACKGROUND Field

The present specification generally relates to molds and methods forcontrolling mold surface quality, more specifically, to molds forshaping glass-based materials.

Technical Background

The current demand in modern electronics devices for thin, threedimensional glass-based substrates that have very high levels of surfacequality has produced a need to find processes that are commerciallycapable of providing defect-free shaped glass-based substrates. Shapedglass forming generally refers to high temperature processes thatinvolve heating the glass to be formed to a temperature at which it canbe manipulated, and then conforming it to a mold to achieve the designedshape. Classic methods of shaping glass substrates include televisiontube forming, where a softened glass gob is pressed between male &female molds, and bottle forming, where glass is blown in a pair ofhollowed molds.

In shaping operations, the quality of the mold surface is important forproducing cosmetically acceptable glass quality that can be polishedinto a final glass article with minimal polishing. Metal molds can havea surface texture that reproduces onto the glass surface during themolding process. This is undesirable and it can be difficult to removethe reproduced texture from the shaped glass with polishing. Thus a needexists to control the mold surface quality to minimize or reduce thepossibility of a surface texture on the mold surface that reproducesonto the shaped glass-based substrate.

SUMMARY

The embodiments described herein relate to molds for shaping glass-basedmaterials, methods for treating mold surfaces to control the quality ofthe mold surfaces. According to a first embodiment, a method fortreating a mold includes grinding an outer metal surface of a mold bodyof the mold with a first material; lapping the outer metal surface afterthe grinding with a second material that is finer than the firstmaterial; and polishing the outer metal surface after the lapping toachieve an average surface roughness (R_(a)) less than or equal to about0.15 μm and a waviness height (W_(a)) less than or equal to about 100nm. In a second embodiment according to the first embodiment, the moldbody may include at least 90% nickel by weight and at least one oftitanium, aluminum, zirconium, silicon, manganese, or cerium, wherein asum of a weight percent of titanium, aluminum, zirconium, silicon,manganese and cerium is in a range from about 0.6% to about 1%. In athird embodiment according to the second embodiment, the mold body mayinclude at least 99% nickel by weight.

In a fourth embodiment according to any of the preceding embodiments,the first material may be an abrasive having a grit size in a range fromabout 600 to about 1200. In a fifth embodiment according to any of thepreceding embodiments, the second material may be an abrasive having agrit size in a range from about 800 to about 1500. In a sixth embodimentaccording to any of the preceding embodiments, the polishing may includeusing a paste having particles with a mean particle size in a range fromabout 6 μm to about 14 μm. In a seventh embodiment according to any ofthe preceding embodiments, one or more of the grinding, lapping, andpolishing is performed in a random motion. In an eighth embodimentaccording to the ninth embodiment the random motion is circular.

In a ninth embodiment according to any of the preceding embodiments, thepolishing achieves an average surface roughness (R_(a)) in a range fromabout 0.04 μm to about 0.15 μm. In a tenth embodiment according to anyof the preceding embodiments, the polishing achieves an average surfaceroughness (R_(a)) in a range or from about 0.06 μm to about 0.1 μm. Inan eleventh embodiment according to any of the preceding embodiments,the polishing achieves a waviness (W_(a)) less than or equal to 40 μm.

In a twelfth embodiment according to any of the preceding embodiments,the method may include comprising oxidizing the outer metal surfaceafter polishing to produce a metal oxide layer, wherein the metal oxidelayer has a surface roughness (R_(a)) less than about 1 μm and waviness(W_(a)) less than about 500 nm. In a thirteenth embodiment according tothe twelfth embodiment, the metal oxide layer includes a plurality ofgrains and the plurality of grains has an average grain size of about300 μm or less. In a fourteenth embodiment according to the thirteenthembodiment, the metal oxide layer includes least one grain body area andat least one grain boundary area and wherein an average heightdifferential between the at least one grain body area and the at leastone grain boundary area is about 2 μm or less.

In a fifteenth embodiment according to any of the preceding embodiments,the method may also include doping the outer metal surface at least oneof titanium, aluminum, zirconium, silicon, manganese, or cerium afterpolishing or after polishing and prior to oxidizing. In a sixteenthembodiment according to any of the preceding embodiments, furtherincluding doping the outer metal surface at least one of titanium,aluminum, zirconium, silicon, manganese, or cerium after polishing.

According to a seventeenth embodiment, a mold can include a mold bodywith an outer metal surface, wherein the outer metal surface has anaverage surface roughness (R_(a)) less than about 0.15 μm and a wavinessheight (W_(a)) less than about 100 nm. In an eighteenth embodimentaccording to the seventeenth embodiment, the mold body may include atleast 90% nickel by weight and at least one of titanium, aluminum,zirconium, silicon, manganese, or cerium, wherein a sum of a weightpercent of titanium, aluminum, zirconium, silicon, manganese and ceriumis in a range from about 0.6% to about 1%. In a nineteenth embodimentaccording to the eighteenth embodiment, the mold body may include atleast 99% nickel by weight. In a twentieth embodiment according to anyof the seventeenth through nineteenth embodiments, the mold body has anaverage surface roughness (R_(a)) in a range from about 0.04 μm to about0.15 μm. In a twenty-first embodiment according to any of theseventeenth through twentieth embodiments, the mold body has an averagesurface roughness (R_(a)) in a range from about 0.06 μm to about 0.1 μm.In a twenty-second embodiment according to any of the seventeenththrough twenty-first embodiments, the mold body has a waviness (W_(a))less than or equal to 40 μm. In a twenty-third embodiment according toany of the seventeenth through twenty-second embodiments, the moldy bodyhas an average surface roughness (R_(a)) in a range from about 0.06 μmto about 0.1 μm and a waviness (W_(a)) less than or equal to 40 μm.

According to a twenty-fourth embodiment, a mold can include a mold bodyhaving a metal surface; and a metal oxide layer on the metal surface ofthe mold body. The metal oxide layer may have first and second opposingsurfaces. The first surface of the metal oxide layer may contact andface the metal surface of the mold body and the second surface of themetal oxide layer may include a plurality of grains. The plurality ofgrains may have an average grain size of about 300 μm or less.

In a twenty-fifth embodiment according to a twenty-sixth embodiment, thesecond surface includes at least one grain body area and at least onegrain boundary area and wherein an average height differential betweenthe at least one grain body area and the at least one grain boundaryarea is about 2 μm or less. In a twenty-sixth embodiment according tothe twenty-fifth embodiment, wherein the height differential is about 1μm or less. In a twenty-seventh embodiment according to any of thetwenty-fourth through twenty-sixth embodiments, the average grain sizeis about 150 μm or less. In a twenty-eighth embodiment according to anyof the twenty-fourth through twenty-seventh embodiments, the secondsurface of the metal oxide layer has waviness (Wa) of less than or equalto about 500 nm. In a twenty-ninth embodiment according to any of thetwenty-fourth through twenty-eighth embodiments, the second surface ofthe metal oxide layer has a waviness (Wa) of less than or equal to about100 nm. In a thirtieth embodiment according to any of the twenty-fourththrough twenty-ninth embodiments, the second surface of the metal oxidelayer has an average surface roughness (Ra) of about 1 μm or less. In athirty-first embodiment according to the thirtieth embodiment, whereinthe second surface of the metal oxide layer has an average surfaceroughness (Ra) of about 0.4 μm or less. In a thirty-second embodimentaccording to the thirty-first embodiment, wherein the second surface ofthe metal oxide layer has an average surface roughness (Ra) in a rangefrom about 0.2 μm to about 0.4 μm. In a thirty-third embodimentaccording to any of the twenty-fourth through thirty-second embodiments,the second surface of the metal oxide layer has a waviness (Wa) of lessthan or equal to about 500 nm and an average surface roughness (Ra) ofabout 1 μm or less. In a thirty-fourth embodiment according to any ofthe twenty-fourth through thirty-third embodiments, the second surfaceof the metal oxide layer has a waviness (Wa) of less than or equal toabout 500 nm and an average surface roughness (Ra) in a range from about0.2 μm to about 0.4 μm. In a thirty-fifth embodiment according to any ofthe twenty-fourth through thirty-fourth embodiments, a ratio of anR_(volume) below the surface of the metal oxide layer divided by theR_(volume) above the surface of the metal oxide layer is less than orequal to 2.

In a thirty-sixth embodiment according to any of the twenty-fourththrough thirty-fifth embodiments, the mold body may include at least 90%nickel by weight and at least one of titanium, aluminum, zirconium,silicon, manganese, or cerium, wherein a sum of a weight percent oftitanium, aluminum, zirconium, silicon, manganese and cerium is in arange from about 0.6% to about 1%. In the thirty-seventh embodimentaccording to the thirty-sixth embodiment the mold body may be at least99% nickel by weight. In a thirty-eighth embodiment according to any ofthe twenty-fourth through thirty-seventh embodiments, the metal oxidelayer may be nickel oxide.

Additional features and advantages of the embodiments described hereinwill be set forth in the detailed description which follows, and in partwill be readily apparent to those skilled in the art from thatdescription or recognized by practicing the embodiments describedherein, including the detailed description which follows, the claims, aswell as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description describe various embodiments and areintended to provide an overview or framework for understanding thenature and character of the claimed subject matter. The accompanyingdrawings are included to provide a further understanding of the variousembodiments, and are incorporated into and constitute a part of thisspecification. The drawings illustrate the various embodiments describedherein, and together with the description serve to explain theprinciples and operations of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The following is a description of the figures in the accompanyingdrawings. The figures are not necessarily to scale, and certain featuresand certain views of the figures may be shown exaggerated in scale or inschematic in the interest of clarity and conciseness.

FIG. 1 is a flowchart of an exemplary process for modifying the surfaceof a mold pre-oxidation.

FIG. 2 schematically depicts the structure of a mold pre-oxidation forshaping glass, according to one or more embodiments shown and describedherein;

FIG. 3 schematically depicts the structure of a mold post-oxidation forshaping glass, according to one or more embodiments shown and describedherein; and

FIG. 4 is a view of an exemplary nickel oxide layer surface taken with aconfocal microscope.

FIG. 5 is a plot showing the affect of the pre-oxidation average surfaceroughness (R_(a)) on the grain boundary height.

FIG. 6A is a profile plot of an exemplary mold surface post-oxidationthat had a mirror finish before oxidation showing the height of thegrain boundaries on the y axis and the distance between the grainboundaries along the width of the sample on the x axis.

FIG. 6B is a profile plot of an exemplary mold surface post-oxidationthat had a matte finish before oxidation showing the height of the grainboundaries on the y axis and the distance between the grain boundariesalong the width of the sample on the x axis

FIG. 7A is an image showing the grain size of a mold polished using alinear motion.

FIG. 7B is an image showing the grain size of a mold polished using acircular motion.

FIG. 8A is a profile plot of an exemplary mold surface post-oxidationthat was doped with aluminum before oxidation showing the height of thegrain boundaries on the y axis and the distance between the grainboundaries along the width of the sample on the x axis.

FIG. 8B is a profile plot of an exemplary mold surface post-oxidationthat was doped with manganese before oxidation showing the height of thegrain boundaries on the y axis and the distance between the grainboundaries along the width of the sample on the x axis.

FIG. 8C is a profile plot of an exemplary mold surface post-oxidationthat was doped with cerium before oxidation showing the height of thegrain boundaries on the y axis and the distance between the grainboundaries along the width of the sample on the x axis.

DETAILED DESCRIPTION

Reference will now be made in detail to various embodiments of molds forshaping glass-based materials and methods for controlling the moldsurface quality, examples of which are illustrated in the accompanyingdrawings. Whenever possible, the same reference numerals will be usedthroughout the drawings to refer to the same or like parts. Embodimentsof methods for controlling mold surface quality, as well as embodimentsof molds for shaping glass-based materials, will be described in moredetail herein with specific reference to the appended drawings.

The following description is provided as an enabling teaching. To thisend, those skilled in the relevant art will recognize and appreciatethat many changes can be made to the various embodiments describedherein, while still obtaining the beneficial results. It will also beapparent that some of the desired benefits can be obtained by selectingsome of the features without utilizing other features. Accordingly,those who work in the art will recognize that many modifications andadaptations to the present embodiments are possible and can even bedesirable in certain circumstances and are a part of the presentdescription. Thus, the following description is provided as illustrativeand should not be construed as limiting.

Disclosed are materials, compounds, compositions, and components thatcan be used for, can be used in conjunction with, can be used inpreparation for, or are embodiments of the disclosed method andcompositions. These and other materials are disclosed herein, and it isunderstood that when combinations, subsets, interactions, groups, etc.of these materials are disclosed that while specific reference of eachvarious individual and collective combinations and permutation of thesecompounds may not be explicitly disclosed, each is specificallycontemplated and described herein. Thus, if a class of substituents A,B, and C are disclosed as well as a class of substituents D, E, and F,and an example of a combination embodiment, A-D is disclosed, then eachis individually and collectively contemplated. Thus, in this example,each of the combinations A-E, A-F, B-D, B-E, B-F, C-D, C-E, and C-F arespecifically contemplated and should be considered disclosed fromdisclosure of A, B, and C; D, E, and F; and the example combination A-D.Likewise, any subset or combination of these is also specificallycontemplated and disclosed. Thus, for example, the sub-group of A-E,B-F, and C-E are specifically contemplated and should be considereddisclosed from disclosure of A, B, and C; D, E, and F; and the examplecombination A-D. This concept applies to all aspects of this disclosureincluding, but not limited to any components of the compositions andsteps in methods of making and using the disclosed compositions. Thus,if there are a variety of additional steps that can be performed it isunderstood that each of these additional steps can be performed with anyspecific embodiment or combination of embodiments of the disclosedmethods, and that each such combination is specifically contemplated andshould be considered disclosed.

In this specification and in the claims which follow, reference will bemade to a number of terms which shall be defined to have the meaningsdetailed herein.

The term “about” references all terms in the range unless otherwisestated. For example, about 1, 2, or 3 is equivalent to about 1, about 2,or about 3, and further comprises from about 1-3, from about 1-2, andfrom about 2-3. Specific and preferred values disclosed forcompositions, components, ingredients, additives, and like aspects, andranges thereof, are for illustration only; they do not exclude otherdefined values or other values within defined ranges. The compositionsand methods of the disclosure include those having any value or anycombination of the values, specific values, more specific values, andpreferred values described herein.

The indefinite article “a” or “an” and its corresponding definitearticle “the” as used herein means at least one, or one or more, unlessspecified otherwise

As used herein, the term “glass-based” includes glass and glass-ceramicmaterials.

As used herein, the term “substrate” describes a glass-based sheet thatmay be formed into a three-dimensional structure.

Generally, disclosed herein is a method for treating a mold to controlthe mold's surface quality and a mold for shaping glass-based material.Glass-based articles formed using the molds described herein may have areduced number of defects. Ideally, the as-formed quality of a part isas good as the glass-based sheet from which it is formed. For the mosteconomical process, one desires that this surface quality is achievedwithout further reworking or polishing of the as-formed surface.Defects, as used herein, include, but are not limited to, dimples(depressions in the glass-based surface), surface checks/cracks,blisters, chips, cords, dice, observable crystals, laps, seeds, stones,orange peel defects (imprint of large oxide grains on formed glass-basedmaterial, and pits in the formed glass-based material from raised areason the mold surface, such as grain boundary areas, for example pitshaving 0.1 micron in height with a diameter greater than 30 microns),and stria. To that end, disclosed herein is a pre-oxidation mold withouta metal oxide layer including a mold body with an outer metal surface,wherein the outer metal surface has a surface roughness (Ra) less thanor equal to about 0.15 μm and a waviness (Wa) less than about 100 nm. Insome embodiments, the mold body may include at least 90% nickel byweight and at least one of titanium, aluminum, zirconium, silicon,manganese, or cerium, wherein a sum of a weight percent of titanium,aluminum, zirconium, silicon, manganese and cerium is in a range fromabout 0.6% to about 1%. Also disclosed herein is a post-oxidation moldhaving a mold body having a metal surface; and a metal oxide layer onthe metal surface of the mold body. The metal oxide layer may have firstand second opposing surfaces. The first surface of the metal oxide layermay contact and face the metal surface of the mold body and the secondsurface of the metal oxide layer may include a plurality of grains. Theplurality of grains may have an average grain size of about 300 μm orless. In some embodiments, the mold body may include at least 90% nickelby weight and at least one of titanium, aluminum, zirconium, silicon,manganese, or cerium, wherein a sum of a weight percent of titanium,aluminum, zirconium, silicon, manganese and cerium is in a range fromabout 0.6% to about 1%. In some embodiments, the metal oxide layer maybe nickel oxide.

Embodiments herein include a method for modifying a mold surface whichwill be used in the formation of glass-based substrates, such asthree-dimensional glass-based substrates. The glass-based substrates maybe useful as front and/or back covers for electronics devices, such astelephones, electronic tablets, televisions etc. In these electronicsapplications, the shape and the surface quality of the glass-basedsubstrate may need to be within very tight tolerances in order toprovide not only aesthetic appeal, but also to minimize weaknesses inthe surface of the glass-based material, potential electronics issues,and minimize costs.

Pre-Oxidation Mold Surface Treatments

In some embodiments, as shown in the exemplary flowchart of FIG. 1, aprocess for modifying a mold surface can include a step 100 of grindinga mold surface, a step 102 of lapping the mold surface, and a step 104of polishing the metal surface. A mold 110 polished according to theembodiments described herein can include a mold body 112 having an outersurface 114, as shown for example in FIG. 2. It should be understoodthat outer surface 114 of mold body 112 can have a wide variety ofshapes to form varying three dimensionally shaped glass-based articles.Outer surface 114 of mold body 112 can initially be CNC machined ormilled to obtain a desired shape. Molds for shaping a glass-basedmaterial often have a metal oxide layer formed on the outer surface ofthe mold body to prevent sticking of the glass-based material to themold during shaping. The metal oxide layer is often formed by subjectingthe outer surface of the mold body to an oxidation treatment. Thegrinding, lapping and polishing processes described herein are performedprior to forming a metal oxide on outer surface 114 of the mold 100.

In some embodiments, mold body 112 may be made of metal, for examplenickel. In some embodiments, mold body 112 may be made of a bulkmaterial of greater than about 90% nickel, or may comprise a layerforming outer surface 114 of at least about 90% nickel on another bulkmaterial. In embodiments, where outer surface 114 is a layer formed onanother bulk material, a thickness of the layer including outer surface114 can be at least about 20 μm, at least about 30 μm, at least about 40μm, or at least about 50 μm. In some embodiments, mold body 112 may havehigh purities of nickel, such as commercially-pure nickel, for formationof three-dimensional glass-based substrates. Nickel metals, as describedbelow, may have excellent oxide layer properties, wherein they form acontinuous native oxide layer that does not delaminate from the basemetal and this oxide layer has excellent non-sticking characteristicswhen contacted by the softened glass-based material. Nickels may berelatively soft, and therefore have been thought to not be strong enoughfor conventional glass-based material forming operations. However,because the embodied processes do not apply heavy force on the mold 110,they allow for use of these materials in novel ways.

In some embodiments, the entire mold body 112 may comprise high puritynickel. In other embodiments, at least a portion of mold body 112including outer surface 114 may comprise high purity nickel. High puritynickel makes it possible to form optical-quality glass-based articles.As used herein, a high purity nickel includes mold bodies having atleast a surface with a composition comprising at least about 90%, about93%, about 95%, about 97%, about 98%, about 99%, about 99.1%, about99.2%, about 99.3%, about 99.4%, or about 99.5%, by weight nickel. Insome embodiments, at least outer surface 114 of mold body 112 maycomprise about 95% to about 99.5%, about 95% to about 99%, about 95% toabout 98%, about 95% to about 97%, about 97% to about 99.5%, about 97%to about 99%, about 97% to about 98%, about 98% to about 99.5%, about98% to about 99%, or about 99% to about 99.1%, about 99% to about 99.2%,about 99% to about 99.3%, about 99% to about 99.4%, or about 99% toabout 99.5% by weight nickel.

Examples of nickel compositions that may be used herein include, but arenot limited to, commercially pure nickel grades 200, 201, 205, 212, 222,and 233 (See. e.g., Special-Purpose Nickel Alloys, in ASM SPECIALTYHANDBOOK: NICKEL, COBALT AND THEIR ALLOYS, #06178G (ASM International2000), herein incorporated by reference in its entirety).

In some embodiments, step 100 of grinding can include grinding outersurface 114 of mold body 112. As discussed above, the grinding, lappingand polishing processes described herein are performed prior to forminga metal oxide layer on outer surface 114 of mold 110. As such, step 100includes grinding an outer metal surface 114 of mold body 112. In someembodiments, grinding can include, but is not limited to, manualgrinding, wetblasting, CNC (computer numerical control) grinding,vibratory grinding, or sandblasting. Grinding can remove or decreasetool marks left on outer metal surface 114 when mold body 112 is formed(e.g., from CNC machining or milling). In some embodiments, the grindingmaterial can be an abrasive material including, but not limited toalumina, diamond, silicon carbide and silica. In some embodiments,depending upon the method of grinding, the abrasive material can be inthe form of a paper or in the form of a slurry having the abrasivematerial in the form of particles. In some embodiments, when a paper isused, the paper can have a grit size in a range from about 600 to about1200 using the ISP/FEPA Grit Designation. In other embodiments, when aslurry is used, the abrasive particles may have a size in a range fromabout 3 μm to about 21 μm and the slurry media may be, for example,deionized water.

In some embodiments, step 102 of lapping may include lapping outersurface 114 of mold body 112 after step 100 of grinding. In someembodiments, lapping may include, but is not limited to manual lapping,wetblasting, CNC (computer numerical control) lapping, vibratorylapping, or sandblasting. Lapping may remove or decrease grinding marksleft from step 100 of grinding outer metal surface 114 of mold body 112and, in some embodiments, this may be accomplished using an abrasivematerial with a finer size than in step 100 of grinding. In someembodiments, the abrasive material may include, but is not limited toalumina, diamond, silicon carbide and silica. In some embodiments, thelapping material may be an abrasive material in the form of a paper, forexample a paper having a grit size in a range from about 800 to about1500 using the ISP/FEPA Grit Designation. In other embodiments, thelapping material may be a slurry having an abrasive material in the formof particles in a slurry, for example, the abrasive particles may have asize in a range from 3 μm to about 21 μm and the slurry media can bedeionized water.

In some embodiments, step 104 of polishing may include polishing outersurface 114 of mold body 112 after step 102 of lapping. In someembodiments, polishing may include, but is not limited to manualpolishing, wetblasting, CNC (computer numerical control) polishing,vibratory polishing, or sandblasting. Polishing may remove or decreaselapping marks left from step 102 of lapping outer metal surface 114 ofmold body 112 and, in some embodiments, this may be accomplished usingan abrasive material with a finer size than in step 102 of lapping. Insome embodiments, the abrasive material may include, but is not limitedto alumina, diamond, silicon carbide and silica. In some embodiments,the lapping material may be a paste including the abrasive material inthe form of particles, for example a paste having a mean particle sizein a range from about 6 μm to about 14 μm. In some embodiments, thepaste can have a mean particle size of about 6 μm, about 7 μm, about 8μm, about 9 μm, about 10 μm, about 11 μm, about 12 μm, about 13 μm, orabout 14 μm.

In some embodiments, one or more of step 100 of grinding, step 102 oflapping, and step 104 of polishing can be performed in a non-linearmotion, for example in a circular motion. Polishing in a linear motioncan result in pronounced, distinct grains on outer metal surface 114,which can ultimately be transferred to the glass-based material asdefects during molding; whereas polishing in a non-linear motion canresult in indistinct grains on outer metal surface 114.

In some embodiments, outer metal surface 114 can be cleaned prior to oneor more of step 100 of grinding, step 102 of lapping, and step 104 ofpolishing. In some embodiments, the cleaning can include one or more ofrinsing outer metal surface 114, for example with deionized water, andultrasonic cleaning.

In some embodiments, outer metal surface 114 can be inspected after oneor more of step 100 of grinding, step 102 of lapping, and step 104 ofpolishing to determine if additional grinding, lapping, or polishing isneeded.

Mold Qualities Post-Polishing and Pre-Oxidation

In some embodiments, after the step 104 of polishing and prior to theformation of a metal oxide layer on outer metal surface 114, outer metalsurface 114 may have “pre-oxidation”attributes. In some embodiments,pre-oxidation outer metal surface 114 may have a waviness, W_(a), whichdescribes the average peak-to-valley height of the surface wavinessprofile of outer metal surface 114. In some embodiments, the W_(a) isfrom about 1 nm to about 100 nm over an evaluation length of 1 cm. Insome embodiments, the W_(a) is less than or equal to about 1 nm, 2 nm, 5nm, 10 nm, 20 nm, 40 nm, 60 nm, 80 nm, or 100 nm over an evaluationlength of 1 cm. The W_(a) can be measured using a confocal microscope,such as one available from Zeiss, or an optical profilometer, such asone available from Zygo.

In some embodiments, pre-oxidation outer metal surface 114 may have anaverage surface roughness (R_(a)) in a range from about 0.03 μm to about0.15 μm, about 0.03 μm to about 0.14 μm, about 0.03 μm to about 0.13 μm,about 0.03 μm to about 0.12 μm, about 0.03 μm to about 0.11 μm, about0.03 μm to about 0.1 μm, about 0.03 μm to about 0.09 μm, about 0.03 μmto about 0.08 μm, about 0.03 μm to about 0.07 μm, about 0.03 μm to about0.06 μm, about 0.03 μm to about 0.05 μm, about 0.03 μm to about 0.04 μm,about 0.04 μm to about 0.15 μm, about 0.04 μm to about 0.14 μm, about0.04 μm to about 0.13 μm, about 0.04 μm to about 0.12 μm, about 0.04 μmto about 0.11 μm, about 0.04 μm to about 0.1 μm, about 0.04 μm to about0.09 μm, about 0.04 μm to about 0.08 μm, about 0.04 μm to about 0.07 μm,about 0.04 μm to about 0.06 μm, about 0.04 μm to about 0.05 μm, about0.05 μm to about 0.15 μm, about 0.05 μm to about 0.14 μm, about 0.05 μmto about 0.13 μm, about 0.05 μm to about 0.12 μm, about 0.05 μm to about0.11 μm, about 0.05 μm to about 0.1 μm, about 0.05 μm to about 0.09 μm,about 0.05 μm to about 0.08 μm, about 0.05 μm to about 0.07 μm, about0.05 μm to about 0.06 μm, about 0.06 μm to about 0.15 μm, about 0.06 μmto about 0.14 μm, about 0.06 μm to about 0.13 μm, about 0.06 μm to about0.12 μm, about 0.06 μm to about 0.11 μm, about 0.06 μm to about 0.1 μm,about 0.06 μm to about 0.09 μm, about 0.06 μm to about 0.08 μm, about0.06 μm to about 0.07 μm, about 0.08 μm to about 0.15 μm, about 0.08 μmto about 0.14 μm, about 0.08 μm to about 0.13 μm, about 0.08 μm to about0.12 μm, about 0.08 μm to about 0.11 μm, about 0.08 μm to about 0.1 μm,about 0.08 μm to about 0.09 μm, about 0.09 μm to about 0.15 μm, about0.09 μm to about 0.14 μm, about 0.09 μm to about 0.13 μm, about 0.09 μmto about 0.12 μm, about 0.09 μm to about 0.11 μm, about 0.09 μm to about0.1 μm, about 0.1 μm to about 0.15 μm, about 0.1 μm to about 0.14 μm,about 0.1 μm to about 0.13 μm, about 0.1 μm to about 0.12 μm, about 0.1μm to about 0.11 μm, about 0.11 μm to about 0.15 μm, about 0.11 μm toabout 0.14 μm, about 0.11 μm to about 0.13 μm, about 0.11 μm to about0.12 μm, about 0.12 μm to about 0.15 μm, about 0.12 μm to about 0.14 μm,about 0.12 μm to about 0.13 μm, about 0.13 μm to about 0.15 μm, or about0.14 μm to about 0.15 μm. In some embodiments, the average surfaceroughness (R_(a)) of pre-oxidation outer metal surface 114 may less thanor equal to about 0.15 μm, 0.14 μm, 0.13 μm, 0.12 μm, 0.11 μm, 0.1 μm,0.09 μm, 0.08 μm, 0.07 μm, 0.06 μm, 0.05 μm, 0.04 μm, or about 0.03 μmIn some embodiments, this average surface roughness (R_(a)) isdetermined over an evaluation length, such as 100 μm, 10 mm, 100 mm,etc. or may be determined based on an analysis of the entire surface114. As used herein, R_(a) is measured over a 260 μm×350 μm sized areaand defined as the arithmetic average of the differences between thelocal surface heights and the average surface height and can bedescribed by the following equation:

${R_{a} = {\frac{1}{n}{\sum\limits_{i = 1}^{n}\; {y_{i}}}}},$

where y_(i) is the local surface height relative to the average surfaceheight. The R_(a) can be measured using a confocal microscope, such asone available from Zeiss, or an optical profilometer, such as oneavailable from Zygo. Pre-oxidation outer metal surface 114 having anaverage surface roughness (R_(a)) in the above ranges provides a mattefinish. Thus in some embodiments, polishing step 104 is performed toachieve a matte finish rather than a mirror finish (e.g., an averagesurface roughness (R_(a)) of less than about 0.03 μm) because a metaloxide layer formed on a matte finish has a smaller grain size and lessdistinct grain boundaries than a metal oxide layer formed on a mirrorfinish, thereby resulting in less defects on glass-based material moldedagainst a metal oxide layer of a mold.

In some embodiments, pre-oxidation outer metal surface 114 may have nodirectional lay. Thus, in some embodiments, pre-oxidation metal surface114 may have a random surface without a preferential direction. Whethera surface has a directional lay (e.g., vertical, horizontal, radial,cross-hatched, circular, isotropic, etc.) may be determined by visualinspection. In some embodiments, pre-oxidation outer metal surface 114may have a randomized polycrystalline orientation as measured usingX-ray diffraction. In some embodiments, pre-oxidation outer metalsurface 114 may have a distortion slope of less than or equal to about2×10⁻⁴. The distortion slope is a measurement of distortion or deviationof a mold surface from the CAD mold drawing of the desired surface. Thedistortion slope can be determined by measuring the slope of thedeviation of the surface in the z direction over the width of a defect.The width can be the point where the distortion deviates from the CADdrawing to the peak depth or height of the distortion area. A stylus oroptical profilometer such as a Zeiss 2000SD or Zygo 7300 can be used tomeasure the distortion slope.

The pre-oxidation attributes of outer metal layer 114 discussed abovemay result from one or more of step 100 of grinding, step 102 oflapping, and step 104 of polishing. The pre-oxidation attributes ofouter metal layer 114 may affect the attributes of the mold afteroxidation. For example, as discussed above, the average surfaceroughness (R_(a)) may affect whether the outer metal layer 114 has amatte finish or surface finish, which in turn may affect the size anddistinctness of grains in a metal oxide layer formed on outer metallayer 114. Also, as discussed above, the motion of step 104 of polishing(linear vs. non-linear) may affect the distinctness of grains on outermetal surface 114.

Oxidation

In some embodiments, a metal oxide layer 120 may be formed on mold body110 by exposing surface 114 of mold body 110 to an oxidizing heattreatment. FIG. 3 shows an exemplary mold 100 having a metal oxide layer120 having a first surface 122 adjacent metal surface 114 and anopposing second surface 124 which because the outer surface of mold 110.The metal of the metal oxide layer is the metal of the mold. Forexample, when mold 100 is predominantly nickel, metal oxide layer 120will be a nickel oxide layer. The oxidizing heat treatment may includeexposing the mold 100 to elevated temperatures sufficient to convert atleast a portion of the metal, for example nickel, at surface 114 of moldbody 112. An exemplary oxidizing heat treatment can include thatdisclosed in Pub. No. US 2014-0202211 A1, which is hereby incorporatedby reference in its entirety.

Metal oxide layer 120 formed on surface 114 of mold body 112 may have anaverage thickness of from about 500 nm to about 20 micron, about 1micron to about 14 micron, about 1 micron to about 10 micron, about 1micron to about 8 micron, about 1 micron to about 6 micron, about 1micron to about 4 micron, about 4 micron to about 20 micron, about 4micron to about 14 micron, about 4 micron to about 10 micron, about 4micron to about 8 micron, about 4 micron to about 6 micron, about 6micron to about 20 micron, about 6 micron to about 14 micron, about 6micron to about 10 micron, about 6 micron to about 8 micron, about 8micron to about 20 micron, about 8 micron to about 14 micron, or about 8micron to about 10 micron. In some embodiments, the nickel oxide layer120 on the mold 110 may have an average thickness of about 100 nm orless, about 200 nm or less, about 300 nm or less, about 400 nm or less,about 500 nm or less, about 750 nm or less, about 1 micron or less,about 2 micron or less, about 3 micron or less, about 4 micron or less,about 5 micron or less, about 6 micron or less, about 7 micron or less,about 8 micron or less, about 9 micron or less, about 10 micron or less,about 12 micron or less, about 15 micron or less, about 18 micron orless, or about 20 micron or less.

Mold Quality Post-Oxidation

In some embodiments, mold 110 may include grains and the grains can growduring the oxidizing heat treatment. As shown for example in FIG. 4, thepresence of grains can form two types of areas on the surface of mold110—a grain body area 132 and a grain boundary area 134—on a surface ofmold 110. During formation of nickel oxide layer 120, the nickel oxidecan form faster on grain boundary areas 134 than on grain body areas132. As a result, areas of surface 124 corresponding to grain boundaryareas 134 will be raised relative to areas of surface 124 correspondingto grain body areas 132. During shaping of glass-based materials, theglass-based materials will contact the raised grain boundary areas 134of mold 110 first when being shaped, potentially causing the pattern ofthe grain boundary areas 134 to be imprinted on the surface of theglass-based material depending upon the size of grain boundary areas134. It has been found that reducing the size of the grain bodies,increases the percentage of the grain boundary areas 134 on surface 124.Increasing the area of the grain boundary areas 134 results in lowerlocalized pressure at the glass-based material/grain boundary interfaceduring shaping. The lower the localized pressure, the less likely agrain boundary impression will be seen on the shaped glass-basedmaterial. It has also been found that reducing the height differentialbetween grain body areas 132 and grain boundary areas 134 can alsominimize the likelihood that a grain boundary impression will be seen onthe shaped glass-based material. A controlled amount of impurities inthe mold, for example, titanium, aluminum, zirconium, silicon,manganese, and cerium, segregate at the grain boundaries to minimize orprevent grain growth by pinning the grain boundaries. The impuritiesalso slow down the diffusion of nickel through the grain boundary areasto form the oxide layer and in turn that slows the formation of thenickel oxide layer at the grain boundary areas, thereby minimizing thegrain boundary height differential. The impurities pinning down thegrain boundaries can also minimize or prevent growth of very largegrains which can produce orange peel imprints on glass shaped with themold that cannot be removed by polishing the glass. It has also beenfound that performing one or more of step 100 of grinding, step 102 oflapping, and step 104 of polishing prior to forming a metal oxide layeron mold 110 can minimize the height differential and can produce smalloxide grain size which does not impart orange peel on glass-basedmaterial shaped with the mold.

In some embodiments, minimizing the impact of grain boundary impressionson glass-based materials shaped on mold 100 can be achieved bycontrolling the average grain size and/or an average height differentialbetween the grain body areas and the grain boundary areas on surface 124of metal oxide layer 120. In some embodiments, the average grain sizemaking up each grain body area 132 on surface 124 can be about 300 μm orless, about 275 μm or less, about 250 μm or less, about 225 μm or less,about 200 μm or less, about 175 μm or less, about 150 μm or less, about145 μm or less, about 140 μm or less, about 135 μm or less, about 130 μmor less, about 125 μm or less, about 120 μm or less, about 115 μm orless, about 110 μm or less, about 105 μm or less, about 100 μm or less,about 95 μm or less, about 90 μm or less, about 85 μm or less, about 80μm or less, about 75 μm or less, about 70 μm or less, about 65 μm orless, about 60 μm or less, about 55 μm or less, about 50 μm, about 45 μmor less, about 40 μm or less, about 35 μm or less, or about 30 μm orless. The average grain size can be determined by measuring the diameterof each grain at its widest point over a field of view and calculatingthe average value. The average grain size can be determined using imageanalysis software, such as Nikon Elements. The magnification can be 100×and the field of view can be 1 mm by 1 mm. The average grain size can becalculated based on 3 fields of view. In some embodiments, the averagesize of the grains making up each grain body area 132 on surface 124 ofmetal oxide layer 120 can be about 4 or above, about 4.5 or above, about5 or above, about 5.5 or above, about 6 or above, about 6.5 or above, orabout 7 or above as measured using ASTM E112-13 and its progeny. Thelarger the value for ASTM E112-13, the smaller the average grain size.The benefits of a smaller grain size are discussed above.

In some embodiments, the average height differential between grain bodyareas 132 and grain boundary areas 134 on surface 124 of metal oxidelayer 120 can be about 2 μm or less, 1.75 μm or less, about 1.5 μm orless, about 1.25 μm or less, about 1 μm or less, about 0.75 μm or less,about 0.5 μm or less, or about 0.25 μm or less. In some embodiments, theaverage height differential can be measured by determining the averagepeak surface roughness (R_(p)) on surface 124 of metal oxide layer 120.In some embodiments, this average surface roughness (R_(p)) isdetermined over an evaluation length, such as 100 μm, 10 mm, 100 mm, 1cm, etc. As used herein, R_(p) is defined as the difference between themaximum height and the average height and can be described by thefollowing equation:

${R_{p} = {\max\limits_{i}y_{i}}},$

where y_(i) is the maximum height relative to the average surfaceheight. The R_(p) can be measured using a confocal microscope, such asone available from Zeiss, or an optical profilometer, such as oneavailable from Zygo.

In some embodiments, the average grain size and/or height differentialbetween the grain body areas and grain boundary areas can be controlledby controlling the amount of manganese, silicon, titanium, aluminum,zirconium, and/or cerium in mold body 112 as a whole or in a region nearsurface 114. In some embodiments, mold body 110 can include acombination of one or more of manganese, silicon, titanium, aluminum,zirconium, and cerium such that the sum of the weight % of theseelements is in a range from about 0.6% to about 1%. In some embodiments,the amount of manganese, silicon, titanium, aluminum, zirconium, and/orcerium in mold body 112 can be controlled by mixing oxides containingone or more of these elements in a desired amount in the slag used toform the bulk material, which is then used to form mold body 112. Insome embodiments, outer metal surface 114 can be doped with one or moreof manganese, silicon, titanium, aluminum, zirconium, and cerium afterstep 104 of polishing and prior to forming oxide layer 120. Doping canincrease the weight percentage of the trace element from about 0.02% toabout 0.3%. The doping can be performed, for example, by washing outermetal surface 114 with a salt solution containing one or more ofmanganese, silicon, titanium, aluminum, zirconium, and cerium. In someembodiments, the salt can be, but is not limited to, a carbonate,ammonium carbonate, or nitrate of one or more of manganese, silicon,titanium, aluminum, zirconium, and cerium. In other embodiments, dopingcan be achieved by polishing outer metal surface 114 with particlescontaining one or more of manganese, silicon, titanium, aluminum,zirconium, and cerium so that the particles become embedded in outermetal surface 114. In some embodiments, other conventional methods fordoping can be used, including, but not limited to, evaporation andchemical vapor deposition. In some embodiments, if doping is achieved bywashing, the washing step can be followed with a heat treatment step toencourage diffusion into the outer metal surface 114. In someembodiments, when cerium or zirconium is doped, the orientation of thegrain boundary growth can be reversed or inverted such that there are noraised grain boundaries.

As described above, in some embodiments, the sum of manganese, silicon,titanium, aluminum, zirconium, and cerium in mold body 112 as a whole orin a region near surface 114 can be controlled. In such embodiments, atleast a portion of mold body 112 near surface 114, which may include theentirety of mold body 112, the sum of manganese, silicon, titanium,aluminum, zirconium, and cerium in weight percent, may include, fromabout 0.6% to about 01%. In embodiments, where only a region nearsurface 112 has a sum of manganese, silicon, titanium, aluminum,zirconium, and cerium in the recited ranges, the portion of mold body110 having the sum of manganese, silicon, titanium, aluminum, zirconium,and cerium in the recited ranges can extend about 20 μm or less, about15 μm or less, about 10 μm or less, or about 5 μm or less from surface112. The sum of manganese, silicon, titanium, aluminum, zirconium,and/or cerium within the ranges listed above segregate into grainboundaries to pin down the grain growth, thereby inhibiting the growthof grains in the nickel.

The glass-based articles formed using the molds 100 with metal oxidelayers 120 described herein may have a reduced number of defects.Ideally, the as formed quality of the part would be as good as theglass-based sheet from which it is formed. For the most economicalprocess, one desires that this surface quality is achieved withoutfurther rework or polishing of the as formed surface. Defects, as usedherein, include, but are not limited to, dimples (depressions in theglass-based surface), surface checks/cracks, blisters, chips, cords,dice, observable crystals, laps, seeds, stones, orange peel defects(imprint of large oxide grains on the formed glass-based material andpits in the formed glass-based material from raised areas on the moldsurface, such as grain boundary areas, for example pits having 0.5micron in height with a diameter greater than 30 microns), and stria. Insome embodiments, there are less than an average of 50, 40, 30, 20, 10,5, 4, 3, 2, or 1 defects that are observable by the unaided human eye at1000 lux in a 25 mm×25 mm area on any of the surfaces. In someembodiments, there are less than an average of 50, 40, 30, 20, 10, 5, 4,3, 2, or 1 defects that are 150 micron in the largest dimension in a 25mm×25 mm area on any of the surfaces, as measured by optical microscopy.In some embodiments, the defect is 1, 2, 3, 5, 10, 20, 30, 40, 50, 60,70, 80, 90, 100, 125, or 150 micron in the largest dimension.

In another embodiment, glass-based articles formed using molds 100 withmetal oxide layers 120 described herein may be essentially flawless. By“essentially flawless,” it is meant that there are no indentations (ordimples) larger than 150 micron in diameter, as measured by an opticalmicroscopy technique, in the surfaces. In some embodiments, there areless than an average of 50, 40, 30, 20, 10, 5, 4, 3, 2, or 1indentations (or dimples) larger than 150 micron in diameter in thelargest dimension in an 25 mm×25 mm area on any of the surfaces, asmeasured by optical microscopy. In some embodiments, the dimple size islarger than 1, 2, 3, 5, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 125, or150 micron in the largest dimension.

Without intending to be held to a particular theory, it is believed thatthe decrease in the level of defects on the as formed glass-basedsurface with nickel molds 100 is due to at least three causes. First, anickel oxide thickness, roughness and porosity prevent glass fromsticking to pure nickel metal. Glass, for example alkali aluminosilicateglass, sticks very strongly to unoxidized nickel metal. The roughnessand porosity prevents bonding of nickel oxide to alkali aluminosilicateglass. If nickel oxide is polished to low roughness it sticks to glass.The porosity provides a sink for alkalis and other elements thatout-diffuse and out-gas from glass at high temperature, so they do notaccumulate on top of the mold surface and create a “sticky” glassy layerover time.

Second, the nickel oxide top layer can be loose and it acts as alubricant in that some small amount of nickel oxide can release andattached to the glass surface preventing the glass from sticking to themold. The released oxide layer is readily replenished by moldre-oxidizing during the forming cycle. The released nickel oxide appearsas light haze on glass that is easily touch polished off.

The third reason for the decreased level of defects on the as formedglass-based surface with nickel is controlling the level of impuritiesand inclusions in the nickel. These impurities may include one or moreof the following: Ti, Al, Zr, Si, Mn and Ce. These impurities aretypically present in the Ni based alloys as oxides, sulfides andcarbides. In many if not most cases the oxides, sulfides and carbidesexist in the microstructure of the Ni alloy as a distinct phase,commonly called an inclusion, that is randomly distributed throughoutthe alloy. A certain percentage of these inclusions will end up on themachined and polished surface of the mold. During the glass formingprocess, these inclusions that are at or near the mold surface can bereactive with the glass and stick to it, or oxidize and react at a ratethat is different from the bulk metal and thus form a protrusion on themold surface. However, as noted above, in some embodiments the moldsinclude a controlled amount of Ti, Al, Zr, Si, Mn and/or Ce to controlthe average grain size and/or average height differential between grainbody areas and grain boundary areas to reduce the level of defects onthe as formed glass-based surface after shaping resulting from grainboundaries. Thus, a balance is struck between including enoughimpurities, such as Ti, Al, Zr, Si, Mn and Ce, to achieve a desiredaverage grain size and/or average height differential between grain bodyareas and grain boundary areas without add so much that too manyinclusions are present on the molding surface.

In some embodiments, metal oxide layer 120 may have an average surfaceroughness (R_(a)) of less than or equal to about 1 micron on surface124. In some embodiments, this average surface roughness (R_(a)) isdetermined over an evaluation length, such as 100 μm, 10 mm, 100 mm,etc. or may be determined based on an analysis of the entire surface 124of nickel oxide layer 120. As used herein, R_(a) is measured over a 260μm×350 μm sized area and defined as the arithmetic average of thedifferences between the local surface heights and the average surfaceheight and can be described by the following equation:

${R_{a} = {\frac{1}{n}{\sum\limits_{i = 1}^{n}\; {y_{i}}}}},$

where y_(i) is the local surface height relative to the average surfaceheight. In other embodiments R_(a) may be less than or equal to about 1μm, 0.9 μm, 0.8 μm, 0.7 μm, 0.6 μm, 0.5 μm, 0.4 μm, 0.35 μm 0.3 μm, 0.25μm, 0.2 μm, 0.15 μm or 0.1 μm over an evaluation length of 10 mm. Insome embodiments, R_(a) may be in a range from about 0.1 μm to about 1μm, about 0.1 μm to about 0.5 μm, about 0.1 μm to about 0.4 μm, about0.1 μm to about 0.3 μm, 0.15 μm to about 1 μm, about 0.15 μm to about0.5 μm, about 0.15 μm to about 0.4 μm, about 0.15 μm to about 0.3 μm,about 0.15 μm to about 0.25 μm, 0.2 μm to about 1 μm, about 0.2 μm toabout 0.5 μm, about 0.2 μm to about 0.4 μm, or about 0.4 μm to about 1μm over an evaluation length of 10 mm. The R_(a) can be measured using aconfocal microscope, such as one available from Zeiss, or an opticalprofilometer, such as one available from Zygo.

In some embodiments, metal oxide layer 120 may have a waviness, W_(a),which describes the arithmetic average peak-to-valley height of thewaviness surface profile of surface 124. In some embodiments, the W_(a)is from about 1 nm to about 500 nm, about 1 nm to about 450 nm, about 1nm to about 400 nm, about 1 nm to about 350 nm, about 1 nm to about 1 nmto about 300 nm, about 1 nm to about 250 nm, about 1 nm to about 200 nm,about 1 nm to about 150 nm, or about 1 nm to about 100 nm over anevaluation length of 1 cm. In some embodiments, the W_(a) is less thanor equal to about 500 nm, 450 nm, 400 nm, 350 nm, 300 nm, 250 nm, 200nm, 150 nm, 100 nm, 80 nm, 60 nm, 40 nm, 20 nm, 10 nm, 5 nm, 2 nm overan evaluation length of 1 cm. The W_(a) can be measured using a confocalmicroscope, such as one available from Zeiss, or an opticalprofilometer, such as one available from Zygo.

In some embodiments, the ratio of the R_(volume) below the surface ofthe metal oxide layer divided by the R_(volume) above the surface of themetal oxide layer is less than or equal to 2, less than or equal to1.75, less than or equal to 1.5, less than or equal to 1.25 or less thanor equal to 1. The R_(volume) is the volume of the average surfaceroughness data specified by software as above or below a surface and canbe measured using an optical profilometer, such as one available fromZygo. An R_(volume) ratio greater than about 2 indicates that there is apredominance of valleys or low lying areas between grain boundaries thatmay lead to protruding grain boundaries transferring to a glass-basedmaterial as a defect during molding.

Embodiments of molds 110 described herein may be used in any formingprocesses, such as 3D glass forming processes. The molds 100 areespecially useful in forming 3D glass articles when used in combinationwith the methods and devices described in U.S. Pat. Nos. 8,783,066 and8,701,443, which are hereby incorporated by reference in theirentireties. The issue of glass sticking to mold 110 during the formingprocess is known to increase with decreasing roughness and decreasingglass viscosity. The embodied nickel molds provide a novel means ofaddressing this sticking or adhesion issue and provide glass-basedarticles with little to no surface defects or flaws.

Molds 110 described herein may be utilized in making glass-basedarticles by forming a glass-based article by contacting a glass-basedmaterial with mold 110 at a temperature sufficient to allow for shapingof the glass-based material. In some embodiments, molds 110 may be usedin the following process: a typical thermal reforming process involvesheating the 2D glass-based sheet to a forming temperature, e.g., atemperature in a temperature range corresponding to a glass viscosity of10⁷ Poise to 10¹¹ Poise or between an annealing point and softeningpoint of the glass, while the 2D glass-based sheet is on top of a mold110. The heated 2D glass-based sheet may start sagging once heated.Typically, vacuum is then applied in between the glass-based sheet andmold 100 to conform the glass-based sheet to the surface 124 and therebyform the glass-based sheet into a 3D glass-based article. After formingthe 3D glass-based article, the 3D glass-based article is cooled to atemperature below the strain point of the glass, which would allowhandling of the 3D glass-based article.

The glass-based articles formed via the embodiments herein may bedescribed by Publ. No. US 2013-0323444 A1. The three-dimensional (3D)glass-based articles can be used to cover an electronic device having adisplay, for example as part or all of the front, back, and or sides ofthe device. The 3D cover glass can protect the display while allowingviewing of and interaction with the display. If used as the front cover,the glass-based articles can have a front cover glass section forcovering the front side of the electronic device, where the display islocated, and one or more side cover glass sections for wrapping aroundthe peripheral side of the electronic device. The front cover glasssection can be made contiguous with the side cover glass section(s).

The preformed glass used to in the processes described herein typicallystarts as a two dimensional (2D) glass sheet. The 2D glass sheet may bemade by a fusion or float process. In some embodiments, the 2D glasssheet is extracted from a pristine sheet of glass formed by a fusionprocess. The pristine nature of the glass may be preserved up until theglass is subjected to a strengthening process, such as an ion-exchangechemical strengthening process. Processes for forming 2D glass sheetsare known in the art and high quality 2D glass sheets are described in,for example, U.S. Pat. Nos. 5,342,426, 6,502,423, 6,758,064, 7,409,839,7,685,840, 7,770,414, and 8,210,001.

In one embodiment, the glass is made from an alkali aluminosilicateglass composition. An exemplary alkali aluminosilicate glass compositioncomprises from about 60 mol % to about 70 mol % SiO₂; from about 6 mol %to about 14 mol % Al₂O₃; from 0 mol % to about 15 mol % B₂O₃; from 0 mol% to about 15 mol % Li₂O; from 0 mol % to about 20 mol % Na₂O; from 0mol % to about 10 mol % K₂O; from 0 mol % to about 8 mol % MgO; from 0mol % to about 10 mol % CaO; from 0 mol % to about 5 mol % ZrO₂; from 0mol % to about 1 mol % SnO₂; from 0 mol % to about 1 mol % CeO₂; lessthan about 50 ppm As₂O₃; and less than about 50 ppm Sb₂O₃; wherein 12mol %≤Li₂O+Na₂O+K₂O≤20 mol % and 0 mol %≤MgO+CaO≤10 mol %. This alkalialuminosilicate glass is described in U.S. Pat. No. 8,158,543.

Another exemplary alkali-aluminosilicate glass composition comprises atleast about 50 mol % SiO₂ and at least about 11 mol % Na₂O, and thecompressive stress is at least about 900 MPa. In some embodiments, theglass further comprises Al₂O₃ and at least one of B₂O₃, K₂O, MgO andZnO, wherein−340+27.1·Al₂O₃−28.7·B₂O₃+15.6·Na₂O−61.4.1K₂O+8.1·(MgO+ZnO)≥0 mol %. Inparticular embodiments, the glass comprises: from about 7 mol % to about26 mol % Al₂O₃; from 0 mol % to about 9 mol % B₂O₃; from about 11 mol %to about 25 mol % Na₂O; from 0 mol % to about 2.5 mol % K₂O; from 0 mol% to about 8.5 mol % MgO; and from 0 mol % to about 1.5 mol % CaO. Theglass is described in Pub. No. US 2013-0004758 A1, the contents of whichare incorporated herein by reference in their entirety.

Other types of glass compositions besides those mentioned above andbesides alkali-aluminosilicate glass composition may be used for the 3Dcover glass. For example, alkali-aluminoborosilicate glass compositionsmay be used for the 3D cover glass. Preferably, the glass compositionsused are ion-exchangeable glass compositions, which are generally glasscompositions containing small alkali or alkaline-earth metals ions thatcan be exchanged for large alkali or alkaline-earth metal ions.Additional examples of ion-exchangeable glass compositions may be foundin U.S. Pat. Nos. 7,666,511; 4,483,700; 5,674,790; 8,969,226; 8,158,543;8,802,581; and 8,586,492, and Pub. No. US 2012-0135226 A1.

While the invention has been described with respect to a limited numberof embodiments, those skilled in the art, having benefit of thisdisclosure, will appreciate that other embodiments can be devised whichdo not depart from the scope of the invention as disclosed herein.Accordingly, the scope of the invention should be limited only by theattached claims.

It should now be understood that the molds disclosed herein may offerthe advantage of reduced flaws on the surface of glass which is shapedby the herein disclosed molds. It should now also be understood thatmolds with superior surface characteristics may be produced by themethods described herein, particularly by utilizing the heating regimesdisclosed herein to produce oxide layers on the shaping surfaces of themolds.

Example 1

Various properties of the outer metal oxide surface of two molds ofdiffering composition were measured. Table 1 below shows the compositionfor each mold and Table 2 below shows various properties of the outermetal oxide surface. Mold 1 with higher impurity levels and smallergrain size had better performance. Large grain size can be related tohigher nickel content (i.e., higher purity). Thus, glass molded usingmold 1 had fewer defects than glass molded using mold 2, primarilybecause of the difference in grain size, surface roughness R_(a), andwaviness W_(a).

TABLE 1 Metal (wt %) Mold 1 Mold 2 Ni 99.36 99.44 Mn 0.25 0.25 Fe — 0.04Zn 0.05 — Cr 0.04 0.07 Ti 0.10 0.15 Si 0.20 0.05

TABLE 2 Property Mold 1 Mold 2 Average Surface Roughness Ra (μm) over a0.35 0.196 0.117 mm × 0.26 mm area Waviness W_(a) (μm) over a 19.84 mm ×14.88 0.328 0.631 mm area Waviness (nm/mm²) obtained by dividing W_(a)1.11 2.14 in nm by product of 19.84 mm × 14.88 mm Rvolume (μm³) belowaverage surface roughness 0.183 0.190 Rvolume (μm³) above averagesurface roughness 0.114 0.086 Grain size (μm) 38.5 419.3

Example 2

The surface roughness R_(a) of fourteen nickel molds having the samecomposition were measured prior to oxidizing the surface of the molds.Each mold was then subjected to the same oxidation process of heatingfrom room temperature to 800° C. at a rate of 100° C./hr and thenholding the molds at 800° C. for 16 hours. After the oxidation process,the maximum grain boundary height was measured. FIG. 5 shows a plot ofthe pre-oxidation surface roughness R_(a) in μm vs. the maximum grainboundary height in μm of the mold surface after oxidation. As can beseen by the fitted line in FIG. 5, decreasing the pre-oxidation surfaceroughness generally increases the grain boundary height. As discussedabove, minimizing the grain boundary height can improve the surfacetexture quality of the mold, thereby preventing or minimizing defectstransferring to the glass-based material during molding.

Example 3

Two nickel molds having the same composition with 0.21% by weightmanganese were polished to the surface roughnesses R_(a) listed in Table3 prior to oxidation. Both molds were subjected to an oxidationtreatment of heating the mold at 900° C. for 1.5 hours. After theoxidation process, the surface roughness R_(a) and waviness W_(a) weremeasured. Table 3 lists the measurements for the two molds.

TABLE 3 Mold 1 2 Pre-oxidation surface 0.02 0.1 roughness R_(a) (μm)Pre-oxidation surface finish mirror matte Post-oxidation surface 0.1430.172 roughness R_(a) (μm) Post-oxidation waviness W_(a) 0.125 0.075(μm)

As can be seen from the data in Table 3, mold 1 having the mirror finishand the lower surface roughness pre-oxidation, had the lower surfaceroughness and higher waviness post-oxidation and mold 2 having the mattefinish and higher surface roughness pre-oxidation, had the highersurface roughness and lower waviness post-oxidation. Mold 1 had anundesirable surface texture with large grains with distinctive grainboundaries as shown by the spikes in FIG. 6A, which is profile plotshowing the height of the grain boundaries on the y axis and thedistance between the grain boundaries along the width of the sample onthe x axis. Mold 2 had a desirable surface texture with small grainswith indistinct grain boundaries as shown in the absence of distinctspikes in FIG. 6B. Thus a mold having a pre-oxidation surface having amatte finish had better surface texture than a mold having pre-oxidationsurface having a mirror finish (e.g., an average surface roughness(R_(a)) of less than about 0.03 μm) upon oxidation of the mold.

Example 4

Three nickel molds were polished pre-oxidation. The first mold waspolished using a linear motion to a surface roughness R_(a) of about0.02 μm; the second mold polished using a linear motion to a surfaceroughness R_(a) of about 0.1 μm; and the third mold was polished using acircular motion to a surface roughness R_(a) of about 0.1 μm. The threemold surfaces were subjected to an oxidation treatment of heating fromroom temperature to 800° C. at a rate of 100° C./hr and then holding themolds at 800° C. for 16 hours. The two molds that were polished using alinear motion had an undesirable surface texture with large distinctgrains, as shown in FIG. 7A, and the mold polished with the circularmotion had a desirable surface texture with small indistinct grains, asshown in FIG. 7B. As discussed above, grinding, lapping, and/orpolishing a mold surface with a random motion, such as a circularmotion, rather than a linear motion results in a mold with bettersurface texture.

Example 5

Three nickel molds were doped with aluminum, manganese, or cerium bywashing the mold surface with an atomized solution—one with a solutionof 1 mg of aluminum oxide to 1 ml of deionized water, one with asolution of 1 mg manganese carbonate to 1 ml of deionized water saltsolution, one with a solution of 1 g cerium ammonium nitrate to 25 ml ofdeionized water. The molds were subjected to an oxidation treatment(while the solutions were on the mold) of heating from room temperatureto 800° C. at a rate of 100° C./hr and then holding the molds at 800° C.for 16 hours. FIGS. 8A-8C show a profile plot of the height of the grainboundaries on the y axis and the distance between the grain boundariesalong the width of the sample on the x axis for the aluminum, manganese,and cerium solutions, respectively. As can be seen, doping decreased thegrain size and distinctiveness of the grain boundaries. For the ceriumammonium nitrate solution (8C), the orientation of the grain boundarygrowth was reversed such that there are no raised grain boundaries.

It is noted that the terms “substantially” and “about” may be utilizedherein to represent the inherent degree of uncertainty that may beattributed to any quantitative comparison, value, measurement, or otherrepresentation. These terms are also utilized herein to represent thedegree by which a quantitative representation may vary from a statedreference without resulting in a change in the basic function of thesubject matter at issue.

Various modifications and variations can be made to the embodimentsdescribed herein without departing from the scope of the claimed subjectmatter. Thus it is intended that the specification cover themodifications and variations of the various embodiments described hereinprovided such modification and variations come within the scope of theappended claims and their equivalents.

We claim:
 1. A method for treating a mold, the method comprising:grinding an outer metal surface of a mold body of the mold with a firstmaterial; lapping the outer metal surface after the grinding with asecond material that is finer than the first material; and polishing theouter metal surface after the lapping to achieve an average surfaceroughness (R_(a)) less than or equal to about 0.15 μm and a waviness(W_(a)) less than or equal to about 100 nm.
 2. The method of claim 1,wherein the mold body comprises: at least 90% nickel by weight; and atleast one of titanium, aluminium, zirconium, silicon, manganese, orcerium, wherein a sum of a weight percent of titanium, aluminium,zirconium, silicon, manganese and cerium is in a range from about 0.6%to about 1%.
 3. The method of claim 2, wherein the mold body comprisesat least 99% nickel by weight.
 4. The method of claim 1, wherein thefirst material comprises an abrasive having a grit size in a range fromabout 600 to about
 1200. 5. The method of claim 1, wherein the secondmaterial comprises an abrasive having a grit size in a range from about800 to about
 1500. 6. The method of claim 1, wherein polishing comprisesusing a paste having particles with a mean particle size in a range fromabout 6 μm to about 14 μm.
 7. The method of claim 1, wherein one or moreof the grinding, lapping, and polishing is performed in a random motion.8. The method of claim 7, wherein the random motion is circular.
 9. Themethod of claim 1, wherein the average surface roughness (R_(a)) is in arange from about 0.04 μm to about 0.15 μm.
 10. The method of claim 1,wherein the average surface roughness (R_(a)) is in a range from about0.06 μm to about 0.1 μm.
 11. The method of claim 1, wherein the waviness(W_(a)) is less than or equal to 40 μm.
 12. The method of claim 1,further comprising oxidizing the outer metal surface after polishing toproduce a metal oxide layer, wherein the metal oxide layer has a surfaceroughness (R_(a)) less than about 1 μm and waviness (W_(a)) less thanabout 500 nm.
 13. The method of claim 12, wherein the metal oxide layerincludes a plurality of grains and the plurality of grains has anaverage grain size of about 300 μm or less.
 14. The method of claim 13,wherein the metal oxide layer includes least one grain body area and atleast one grain boundary area and wherein an average height differentialbetween the at least one grain body area and the at least one grainboundary area is about 2 μm or less.
 15. The method of claim 12, furthercomprising doping the outer metal surface at least one of titanium,aluminium, zirconium, silicon, manganese, or cerium after polishing andprior to oxidizing.
 16. The method of claim 1, further comprising dopingthe outer metal surface at least one of titanium, aluminium, zirconium,silicon, manganese, or cerium after polishing.